Description
Master Bond UV22DC80-1 is a one component, low viscosity, nanosilica filled epoxy based system for bonding, sealing and coating. It is a dual cure systems with UV and heat curing mechanisms. The UV portion of the cure can be achieved in seconds upon exposure to a UV light at 365 nm with 20-40 milliwatts/cm2 of energy. This type of formulation allows for polymerization in “shadowed out” areas with the addition of heat at 80°C for 40-60 minutes. This advantageous low temperature is useful when working with plastics or other heat sensitive substrates. The system passes NASA low outgassing specifications. It is electrically insulative, abrasion resistant, has low shrinkage upon cure, and is dimensionally stable. It also features a high physical strength profile. It may be recommended in aerospace, optical and opto-electronic applications.