Chemicals are used in laboratories around the globe for a seemingly endless array of experimental and investigative procedures including those in chemistry, biochemistry, cellular biology, and molecular biology. Some categories of chemicals include Acids and Bases, Reagents, Adhesives, Solvents, Buffers, Flammable Liquids and more.
Lab chemicals are vast and can vary in grade, concentration, or consistency in accordance with their intended applications. Chemical grades include ACS Grade (USP and NF are ACS equivalencies), Reagent Grade, Laboratory Grade, and Technical grade.
Explore and compare laboratory chemicals across leading suppliers at Labcompare; including access to product citations and first-hand reviews from our scientific community.
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| Company | Master Bond | Master Bond | Master Bond | Master Bond | Master Bond |
| Item | EP29LPSP Epoxy Compound | EP3UF No Mix, Thermally-conductive, Electrically-insulative Epoxy for Underfill Applications | EP40TC Low Outgassing Epoxy | EP5G-80 Graphite Filled Epoxy | Supreme 121AOND: Toughened, Non-Drip Epoxy Features High Glass Transition Temperature |
| Citations | | | | | |
| Catalog Number | EP29LPSP | EP3UF | EP40TC | EP5G-80 | Supreme 121AOND |
| Price | Supplier Page | Supplier Page | Supplier Page | Supplier Page | Supplier Page |
| Description | Master Bond EP29LPSP is a two component epoxy adhesive, sealant that can withstand temperatures as low as 4K. It is resistant to cryogenic shocks ,from room temperature down to liquid helium temperatures, in a 5-10 minute time period. The system is NASA low outgassing approved. Additional features Master Bond EP29LPSP is a two component epoxy adhesive, sealant that can withstand temperatures as low as 4K. It is resistant to cryogenic shocks ,from room temperature down to liquid helium temperatures, in a 5-10 minute time period. The system is NASA low outgassing approved. Additional features include optical clarity, electrical insulation and low viscosity. EP29LPSP bonds well to a wide variety of substrates including metals, glass, ceramics, composites and many different plastics. The working life is long, a 100 gram mass will allow over 4-5 hours of working life.... Read More | EP3UF is a one component epoxy that contains thermally conductive fillers with very small particle sizes imparting a low thermal resistance. This low viscosity system has good flow properties and can be applied in bond lines as thin as 10-15 microns. | EP40TC is a two part epoxy system, designed for bonding, sealing and encapsulating applications where thermal conductivity and electrical insulation are required. It is formulated with a small particle size filler making it ideal for filling small cavities and applying the product in thin sections. | EP5G-80 is a one component, NASA low outgassing rated epoxy, with a moderate temperature cure requirement of 80°C for 4 hours. This graphite filled compound features electrical and thermal conductivity. | Supreme 121AOND is a two component, heat curing system with a thixotropic paste consistency for bonding and sealing applications. |
| Quantity | 1/2 pint kits, pint kits, quart kits, gallon kits, premixed and frozen syringes | 10cc syringes, 30cc syringes | Ounce, 1/2 pint, pint, quart, gallon, premixed and frozen syringes | Syringes, ounce jars, 1/2 Pint jars | 1/2 pint kits, pint kits, quart kits, gallon kits |
| Type | Two part epoxy | One part epoxy | Two part epoxy | One part epoxy | Two part epoxy |
| Format | Inquire | Inquire | Inquire | Thixotropic paste | Paste |
| Applications | Bonding, sealing, potting, casting | Bonding, underfill | Bonding, sealing | Bonding, sealing, coating | Bonding, sealing, coating, gap filling |
| Applications | Bonding, Sealing | Bonding, Underfill | Bonding, Sealing | Bonding, Coating, Sealing | Bonding, Coating, Sealing |
| Get Quote | Supplier Page | Supplier Page | Supplier Page | Supplier Page | Supplier Page |