Chemicals are used in laboratories around the globe for a seemingly endless array of experimental and investigative procedures including those in chemistry, biochemistry, cellular biology, and molecular biology. Some categories of chemicals include Acids and Bases, Reagents, Adhesives, Solvents, Buffers, Flammable Liquids and more.
Lab chemicals are vast and can vary in grade, concentration, or consistency in accordance with their intended applications. Chemical grades include ACS Grade (USP and NF are ACS equivalencies), Reagent Grade, Laboratory Grade, and Technical grade.
Explore and compare laboratory chemicals across leading suppliers at Labcompare; including access to product citations and first-hand reviews from our scientific community.
|  |  |  |  |  |
| Company | Master Bond | Master Bond | Master Bond | Master Bond | Master Bond |
| Item | EP42HT-3AO Thermally-conductive Potting Compound | EP3HTS-TC Thermally Conductive Epoxy | EP3UF No Mix, Thermally-conductive, Electrically-insulative Epoxy for Underfill Applications | EP40TC Low Outgassing Epoxy | EP4EN-80 Fast-curing Epoxy |
| Citations | | | | | |
| Catalog Number | EP42HT-3AO | EP3HTS-TC | EP3UF | EP40TC | EP4EN-80 |
| Price | Supplier Page | Supplier Page | Supplier Page | Supplier Page | Supplier Page |
| Description | EP42HT-3AO is a two component, moderate viscosity epoxy system with good flow properties. It is ideal for small to moderate size encapsulating, potting and casting applications and is NASA low outgassing approved. | EP3HTS-TC is a one part, NASA low outgassing rated epoxy, with an outstanding thermal conductivity. EP3HTS-TC utilizes a non-sintering silver technology to provide ultra high heat transfer capability. | EP3UF is a one component epoxy that contains thermally conductive fillers with very small particle sizes imparting a low thermal resistance. This low viscosity system has good flow properties and can be applied in bond lines as thin as 10-15 microns. | EP40TC is a two part epoxy system, designed for bonding, sealing and encapsulating applications where thermal conductivity and electrical insulation are required. It is formulated with a small particle size filler making it ideal for filling small cavities and applying the product in thin sections. | EP4EN-80 is a NASA low outgassing approved epoxy, which can cure at temperatures as low as 80°C. |
| Quantity | Ounce kits, 1/2 pint kits, pint kits, quart kits | 20 gram, 50 gram, 100 gram, one pound, multiple pound syringes or jars | 10cc syringes, 30cc syringes | Ounce, 1/2 pint, pint, quart, gallon, premixed and frozen syringes | 1/2 pints, pints, quarts, gallons |
| Type | Two part epoxy | One part epoxy | One part epoxy | Two part epoxy | One part epoxy |
| Format | Inquire | Paste | Inquire | Inquire | Inquire |
| Applications | Bonding, sealing, coating, encapsulation | Bonding, sealing, coating, die attaching | Bonding, underfill | Bonding, sealing | Bonding, small encapsulation |
| Applications | Bonding, Coating, Sealing, Encapsulating | Bonding, Coating, Sealing | Bonding, Underfill | Bonding, Sealing | Bonding, Encapsulating |
| Get Quote | Supplier Page | Supplier Page | Supplier Page | Supplier Page | Supplier Page |