Chemicals are used in laboratories around the globe for a seemingly endless array of experimental and investigative procedures including those in chemistry, biochemistry, cellular biology, and molecular biology. Some categories of chemicals include Acids and Bases, Reagents, Adhesives, Solvents, Buffers, Flammable Liquids and more.
Lab chemicals are vast and can vary in grade, concentration, or consistency in accordance with their intended applications. Chemical grades include ACS Grade (USP and NF are ACS equivalencies), Reagent Grade, Laboratory Grade, and Technical grade.
Explore and compare laboratory chemicals across leading suppliers at Labcompare; including access to product citations and first-hand reviews from our scientific community.
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| Company | Master Bond | Master Bond | Master Bond | Master Bond | Master Bond |
| Item | EP30-2 Epoxy System | EP21TCHT-1 Epoxy Compound | EP37-3FLF Optically Clear, Highly Flexible Epoxy | EP3HTSMed Electrically Conductive, Silver-filled Adhesive/Sealant | EP40TC Low Outgassing Epoxy |
| Citations | | | | | |
| Catalog Number | EP30-2 | EP21TCHT-1 | EP37-3FLF | EP3HTSMed | EP40TC |
| Price | Supplier Page | Supplier Page | Supplier Page | Supplier Page | Supplier Page |
| Description | Master Bond EP30-2 is a lower viscosity, two component epoxy for high performance bonding, sealing, coating and small potting applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures with a 10 to 1 mix ratio by weight. This system is recommended where low Master Bond EP30-2 is a lower viscosity, two component epoxy for high performance bonding, sealing, coating and small potting applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures with a 10 to 1 mix ratio by weight. This system is recommended where low viscosity is required, and for applications in which bonded assemblies must exhibit superior dimensional stability. Shrinkage upon cure is exceptionally low. It forms high strength and tough bonds which are resistant to thermal cycling and chemicals including water, oil and most organic solvents. It is serviceable over the temperature range of 4K to 300°F. Adhesion to both similar and dissimilar materials including metals, glass, ceramics, rubbers and many plastics is excellent. It is electrically insulative and optically clear. Master Bond EP30-2 is widely used in the aerospace, electronic, optical, and specialty OEM industries. EP30-2 also meets NASA Low Outgassing specifications.... Read More | Master Bond EP21TCHT-1 is a two component, thermally conductive, heat resistant, epoxy compound formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a 100 to 60 mix ratio by weight. EP21TCHT-1 passes NASA outgassing tests. It is a high strength adhesive and Master Bond EP21TCHT-1 is a two component, thermally conductive, heat resistant, epoxy compound formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a 100 to 60 mix ratio by weight. EP21TCHT-1 passes NASA outgassing tests. It is a high strength adhesive and produces bonds that are both tough and durable. It resists thermal cycling and many chemicals including water, fuels and most organic solvents. It has a service temperature range of 4K up to 400°F. It adheres well to metals, glass, ceramics, rubbers and many plastics. The hardened adhesive exhibits high thermal conductivity and superior electrical insulation. The thermal expansion coefficient is remarkably low. EP21TCHT-1 is widely used in aerospace, electronics, electronic, automotive and chemical industries. As a NASA qualified system, it is ideal for high vacuum type applications, particularly those where elevated temperature cures are not possible. It also passes MIL-STD-810G for fungal resistance, and withstands 1,000 hours at 85°C/85% RH.... Read More | EP37-3FLF is used in demanding applications where highly flexible, impact resistant bonds are required. It has low exotherm which makes it a superb potting, encapsulating and casting system, especially where wider cross section thicknesses are specified. | EP3HTSMed is a one component, silver filled, electrically conductive epoxy system featuring high shear strength and good temperature resistance along with a fast cure schedule. The epoxy system fully meets USP Class VI requirements. | EP40TC is a two part epoxy system, designed for bonding, sealing and encapsulating applications where thermal conductivity and electrical insulation are required. It is formulated with a small particle size filler making it ideal for filling small cavities and applying the product in thin sections. |
| Quantity | 1/2 pint kits, pint kits, quart kits, gallon kits, gun kits | 1/2 pint kits, pint kits, quart kits, gallon kits, premixed and frozen syringes | 1/2 pint kits, pint kits, quart kits, gallon kits, gun kits, premixed and frozen syringes | 20 grams, 50 grams, 100 grams, 1 pound, multiple pounds, packaged in either syringes or glass jars | Ounce, 1/2 pint, pint, quart, gallon, premixed and frozen syringes |
| Type | Two part epoxy | Two part epoxy | Two part epoxy | Inquire | Two part epoxy |
| Format | Inquire | Thixotropic paste | Inquire | Thixotropic paste | Inquire |
| Applications | Bonding, sealing, coating, encapsulation | Bonding, sealing | Bonding, coating, casting | Bonding, sealing | Bonding, sealing |
| Applications | Bonding, Coating, Sealing | Bonding, Sealing | Bonding, Casting, Coating | Bonding, Sealing | Bonding, Sealing |
| Get Quote | Supplier Page | Supplier Page | Supplier Page | Supplier Page | Supplier Page |