Chemicals are used in laboratories around the globe for a seemingly endless array of experimental and investigative procedures including those in chemistry, biochemistry, cellular biology, and molecular biology. Some categories of chemicals include Acids and Bases, Reagents, Adhesives, Solvents, Buffers, Flammable Liquids and more.
Lab chemicals are vast and can vary in grade, concentration, or consistency in accordance with their intended applications. Chemical grades include ACS Grade (USP and NF are ACS equivalencies), Reagent Grade, Laboratory Grade, and Technical grade.
Explore and compare laboratory chemicals across leading suppliers at Labcompare; including access to product citations and first-hand reviews from our scientific community.
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| Company | Master Bond | Master Bond | Master Bond | Master Bond | Master Bond |
| Item | EP29LPSP Epoxy Compound | EP21TDCS-LO Silver Conductive Epoxy Meets NASA Low Outgassing Standards | EP3HTSMed Electrically Conductive, Silver-filled Adhesive/Sealant | EP42HT-3AO Thermally-conductive Potting Compound | MasterSil 153AO Additional Cured Silicone |
| Citations | | | | | |
| Catalog Number | EP29LPSP | EP21TDCS-LO | EP3HTSMed | EP42HT-3AO | MasterSil 153AO |
| Price | Supplier Page | Supplier Page | Supplier Page | Supplier Page | Supplier Page |
| Description | Master Bond EP29LPSP is a two component epoxy adhesive, sealant that can withstand temperatures as low as 4K. It is resistant to cryogenic shocks ,from room temperature down to liquid helium temperatures, in a 5-10 minute time period. The system is NASA low outgassing approved. Additional features Master Bond EP29LPSP is a two component epoxy adhesive, sealant that can withstand temperatures as low as 4K. It is resistant to cryogenic shocks ,from room temperature down to liquid helium temperatures, in a 5-10 minute time period. The system is NASA low outgassing approved. Additional features include optical clarity, electrical insulation and low viscosity. EP29LPSP bonds well to a wide variety of substrates including metals, glass, ceramics, composites and many different plastics. The working life is long, a 100 gram mass will allow over 4-5 hours of working life.... Read More | EP21TDCS-LO is an electrically conductive, silver-filled epoxy widely used for demanding applications in the electronic, electrical, computer, semiconductor, aerospace and optical industries. It is suitable for cryogenic applications, serviceable down to 4K. | EP3HTSMed is a one component, silver filled, electrically conductive epoxy system featuring high shear strength and good temperature resistance along with a fast cure schedule. The epoxy system fully meets USP Class VI requirements. | EP42HT-3AO is a two component, moderate viscosity epoxy system with good flow properties. It is ideal for small to moderate size encapsulating, potting and casting applications and is NASA low outgassing approved. | MasterSil 153AO is an addition cured, two part silicone with a self priming property. It has a high tensile lap shear strength, especially for a silicone. The system is thermally conductive and electrically insulating. |
| Quantity | 1/2 pint kits, pint kits, quart kits, gallon kits, premixed and frozen syringes | 20 gram kits, 50 gram kits, 100 gram kits, 1 pound kits, premixed and frozen syringes | 20 grams, 50 grams, 100 grams, 1 pound, multiple pounds, packaged in either syringes or glass jars | Ounce kits, 1/2 pint kits, pint kits, quart kits | ½ pint kits, pint kits, quart kits, gallon kits |
| Type | Two part epoxy | Two part epoxy | Inquire | Two part epoxy | Two part silicone |
| Format | Inquire | Paste | Thixotropic paste | Inquire | Inquire |
| Applications | Bonding, sealing, potting, casting | Bonding, sealing | Bonding, sealing | Bonding, sealing, coating, encapsulation | Bonding, sealing |
| Applications | Bonding, Sealing | Bonding, Sealing | Bonding, Sealing | Bonding, Coating, Sealing, Encapsulating | Bonding, Sealing |
| Get Quote | Supplier Page | Supplier Page | Supplier Page | Supplier Page | Supplier Page |