Chemicals are used in laboratories around the globe for a seemingly endless array of experimental and investigative procedures including those in chemistry, biochemistry, cellular biology, and molecular biology. Some categories of chemicals include Acids and Bases, Reagents, Adhesives, Solvents, Buffers, Flammable Liquids and more.
Lab chemicals are vast and can vary in grade, concentration, or consistency in accordance with their intended applications. Chemical grades include ACS Grade (USP and NF are ACS equivalencies), Reagent Grade, Laboratory Grade, and Technical grade.
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Company | Master Bond | Master Bond | Master Bond | Master Bond | Master Bond |
Item | EP29LPSP Epoxy Compound | EP37-3FLF Optically Clear, Highly Flexible Epoxy | EP3HTS-TC Thermally Conductive Epoxy | EP3HTSMed Electrically Conductive, Silver-filled Adhesive/Sealant | EP3UF No Mix, Thermally-conductive, Electrically-insulative Epoxy for Underfill Applications |
Citations | | | | | |
Catalog Number | EP29LPSP | EP37-3FLF | EP3HTS-TC | EP3HTSMed | EP3UF |
Price | Supplier Page | Supplier Page | Supplier Page | Supplier Page | Supplier Page |
Description | Master Bond EP29LPSP is a two component epoxy adhesive, sealant that can withstand temperatures as low as 4K. It is resistant to cryogenic shocks ,from room temperature down to liquid helium temperatures, in a 5-10 minute time period. The system is NASA low outgassing approved. Additional features Master Bond EP29LPSP is a two component epoxy adhesive, sealant that can withstand temperatures as low as 4K. It is resistant to cryogenic shocks ,from room temperature down to liquid helium temperatures, in a 5-10 minute time period. The system is NASA low outgassing approved. Additional features include optical clarity, electrical insulation and low viscosity. EP29LPSP bonds well to a wide variety of substrates including metals, glass, ceramics, composites and many different plastics. The working life is long, a 100 gram mass will allow over 4-5 hours of working life.... Read More | EP37-3FLF is used in demanding applications where highly flexible, impact resistant bonds are required. It has low exotherm which makes it a superb potting, encapsulating and casting system, especially where wider cross section thicknesses are specified. | EP3HTS-TC is a one part, NASA low outgassing rated epoxy, with an outstanding thermal conductivity. EP3HTS-TC utilizes a non-sintering silver technology to provide ultra high heat transfer capability. | EP3HTSMed is a one component, silver filled, electrically conductive epoxy system featuring high shear strength and good temperature resistance along with a fast cure schedule. The epoxy system fully meets USP Class VI requirements. | EP3UF is a one component epoxy that contains thermally conductive fillers with very small particle sizes imparting a low thermal resistance. This low viscosity system has good flow properties and can be applied in bond lines as thin as 10-15 microns. |
Quantity | 1/2 pint kits, pint kits, quart kits, gallon kits, premixed and frozen syringes | 1/2 pint kits, pint kits, quart kits, gallon kits, gun kits, premixed and frozen syringes | 20 gram, 50 gram, 100 gram, one pound, multiple pound syringes or jars | 20 grams, 50 grams, 100 grams, 1 pound, multiple pounds, packaged in either syringes or glass jars | 10cc syringes, 30cc syringes |
Type | Two part epoxy | Two part epoxy | One part epoxy | Inquire | One part epoxy |
Format | Inquire | Inquire | Paste | Thixotropic paste | Inquire |
Applications | Bonding, sealing, potting, casting | Bonding, coating, casting | Bonding, sealing, coating, die attaching | Bonding, sealing | Bonding, underfill |
Applications | Bonding, Sealing | Bonding, Casting, Coating | Bonding, Coating, Sealing | Bonding, Sealing | Bonding, Underfill |
Get Quote | Supplier Page | Supplier Page | Supplier Page | Supplier Page | Supplier Page |