Chemicals are used in laboratories around the globe for a seemingly endless array of experimental and investigative procedures including those in chemistry, biochemistry, cellular biology, and molecular biology. Some categories of chemicals include Acids and Bases, Reagents, Adhesives, Solvents, Buffers, Flammable Liquids and more.
Lab chemicals are vast and can vary in grade, concentration, or consistency in accordance with their intended applications. Chemical grades include ACS Grade (USP and NF are ACS equivalencies), Reagent Grade, Laboratory Grade, and Technical grade.
Explore and compare laboratory chemicals across leading suppliers at Labcompare; including access to product citations and first-hand reviews from our scientific community.
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| Company | Master Bond | Master Bond | Master Bond | Master Bond | Master Bond |
| Item | LED405Med LED Curable System | EP21NS Nanosilica-filled Epoxy | EP21TCHT-1 Epoxy Compound | EP30-2 Epoxy System | EP42HT-3AO Thermally-conductive Potting Compound |
| Citations | | | | | |
| Catalog Number | LED405Med | EP21NS | EP21TCHT-1 | EP30-2 | EP42HT-3AO |
| Price | Supplier Page | Supplier Page | Supplier Page | Supplier Page | Supplier Page |
| Description | LED405Med is a one part, nano-silica filled system that cures upon exposure to a 405 nm LED light. It meets ISO 10993-5 cytotoxicity requirements for use in medical device assembly. The nanosilica filler results in both lower shrinkage upon cure, as well as greater dimensional stability with a LED405Med is a one part, nano-silica filled system that cures upon exposure to a 405 nm LED light. It meets ISO 10993-5 cytotoxicity requirements for use in medical device assembly. The nanosilica filler results in both lower shrinkage upon cure, as well as greater dimensional stability with a coefficient of thermal expansion of 35-40 in/in x 10-6/°C. It provides good toughness, is optically clear with a refractive index of 1.50, and offers excellent light transmission properties. The system can be used for bonding, sealing, coating and small encapsulations involving optical assemblies or other sensitive components.... Read More | EP21NS is a two part epoxy with a nanosilica filler that imparts dimensional stability and abrasion resistance. It features a moderate viscosity, high compressive strength and electrical insulation. | Master Bond EP21TCHT-1 is a two component, thermally conductive, heat resistant, epoxy compound formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a 100 to 60 mix ratio by weight. EP21TCHT-1 passes NASA outgassing tests. It is a high strength adhesive and Master Bond EP21TCHT-1 is a two component, thermally conductive, heat resistant, epoxy compound formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a 100 to 60 mix ratio by weight. EP21TCHT-1 passes NASA outgassing tests. It is a high strength adhesive and produces bonds that are both tough and durable. It resists thermal cycling and many chemicals including water, fuels and most organic solvents. It has a service temperature range of 4K up to 400°F. It adheres well to metals, glass, ceramics, rubbers and many plastics. The hardened adhesive exhibits high thermal conductivity and superior electrical insulation. The thermal expansion coefficient is remarkably low. EP21TCHT-1 is widely used in aerospace, electronics, electronic, automotive and chemical industries. As a NASA qualified system, it is ideal for high vacuum type applications, particularly those where elevated temperature cures are not possible. It also passes MIL-STD-810G for fungal resistance, and withstands 1,000 hours at 85°C/85% RH.... Read More | Master Bond EP30-2 is a lower viscosity, two component epoxy for high performance bonding, sealing, coating and small potting applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures with a 10 to 1 mix ratio by weight. This system is recommended where low Master Bond EP30-2 is a lower viscosity, two component epoxy for high performance bonding, sealing, coating and small potting applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures with a 10 to 1 mix ratio by weight. This system is recommended where low viscosity is required, and for applications in which bonded assemblies must exhibit superior dimensional stability. Shrinkage upon cure is exceptionally low. It forms high strength and tough bonds which are resistant to thermal cycling and chemicals including water, oil and most organic solvents. It is serviceable over the temperature range of 4K to 300°F. Adhesion to both similar and dissimilar materials including metals, glass, ceramics, rubbers and many plastics is excellent. It is electrically insulative and optically clear. Master Bond EP30-2 is widely used in the aerospace, electronic, optical, and specialty OEM industries. EP30-2 also meets NASA Low Outgassing specifications.... Read More | EP42HT-3AO is a two component, moderate viscosity epoxy system with good flow properties. It is ideal for small to moderate size encapsulating, potting and casting applications and is NASA low outgassing approved. |
| Quantity | 1/2 pint, pint, quart, syringe | ounce kits, ½ pint kits, pint kits, quart kits | 1/2 pint kits, pint kits, quart kits, gallon kits, premixed and frozen syringes | 1/2 pint kits, pint kits, quart kits, gallon kits, gun kits | Ounce kits, 1/2 pint kits, pint kits, quart kits |
| Type | LED curable adhesive | Two part epoxy | Two part epoxy | Two part epoxy | Two part epoxy |
| Format | Inquire | Inquire | Thixotropic paste | Inquire | Inquire |
| Applications | Bonding, sealing, coating | Bonding, sealing, coating, encapsulation | Bonding, sealing | Bonding, sealing, coating, encapsulation | Bonding, sealing, coating, encapsulation |
| Applications | Bonding, Coating, Sealing | Bonding, Coating, Sealing | Bonding, Sealing | Bonding, Coating, Sealing | Bonding, Coating, Sealing, Encapsulating |
| Get Quote | Supplier Page | Supplier Page | Supplier Page | Supplier Page | Supplier Page |