Chemicals are used in laboratories around the globe for a seemingly endless array of experimental and investigative procedures including those in chemistry, biochemistry, cellular biology, and molecular biology. Some categories of chemicals include Acids and Bases, Reagents, Adhesives, Solvents, Buffers, Flammable Liquids and more.
Lab chemicals are vast and can vary in grade, concentration, or consistency in accordance with their intended applications. Chemical grades include ACS Grade (USP and NF are ACS equivalencies), Reagent Grade, Laboratory Grade, and Technical grade.
Explore and compare laboratory chemicals across leading suppliers at Labcompare; including access to product citations and first-hand reviews from our scientific community.
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| Company | Master Bond | Master Bond | Master Bond | Master Bond | Master Bond |
| Item | EP4EN-80 Fast-curing Epoxy | EP30-2 Epoxy System | EP33 NASA Low Outgassing Epoxy Meets MIL-STD-883J | MasterSil 151S Low Outgassing Silicone | Supreme 18TC Conductive Epoxy Adhesive |
| Citations | | | | | |
| Catalog Number | EP4EN-80 | EP30-2 | EP33 | MasterSil 151S | Supreme 18TC |
| Price | Supplier Page | Supplier Page | Supplier Page | Supplier Page | Supplier Page |
| Description | EP4EN-80 is a NASA low outgassing approved epoxy, which can cure at temperatures as low as 80°C. | Master Bond EP30-2 is a lower viscosity, two component epoxy for high performance bonding, sealing, coating and small potting applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures with a 10 to 1 mix ratio by weight. This system is recommended where low Master Bond EP30-2 is a lower viscosity, two component epoxy for high performance bonding, sealing, coating and small potting applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures with a 10 to 1 mix ratio by weight. This system is recommended where low viscosity is required, and for applications in which bonded assemblies must exhibit superior dimensional stability. Shrinkage upon cure is exceptionally low. It forms high strength and tough bonds which are resistant to thermal cycling and chemicals including water, oil and most organic solvents. It is serviceable over the temperature range of 4K to 300°F. Adhesion to both similar and dissimilar materials including metals, glass, ceramics, rubbers and many plastics is excellent. It is electrically insulative and optically clear. Master Bond EP30-2 is widely used in the aerospace, electronic, optical, and specialty OEM industries. EP30-2 also meets NASA Low Outgassing specifications.... Read More | EP33 is a two part, room temperature curing epoxy system featuring high temperature resistance, good dimensional stability and very good chemical resistance. It is easily machinable, radiation resistant, and meets NASA low outgassing specifications. | Master Bond MasterSil 151S is an addition curing two part silicone system that may be used as an adhesive, sealant, coating or form-in-place gasketing material. It retains superior electrical conductivity with a volume resistivity of 0.004 ohm-cm at 75°F. This silicone is recommended for Master Bond MasterSil 151S is an addition curing two part silicone system that may be used as an adhesive, sealant, coating or form-in-place gasketing material. It retains superior electrical conductivity with a volume resistivity of 0.004 ohm-cm at 75°F. This silicone is recommended for applications where low stress is required, since it is highly flexible across a wide service temperature range. It is also capable of resisting aggressive thermal cycles and shocks. MasterSil 151S bonds well to a variety of substrates including metals, ceramics, composites and many plastics and rubbers.... Read More | Supreme 18TC is a single component epoxy adhesive that contains a blend of special thermally conductive fillers. This smooth paste system can be applied in bond lines as thin as 10-15 microns. It offers an exceptionally low thermal resistance of 5-7 x 10-6 K•m2/W and a thermal conductivity of 22-25 Supreme 18TC is a single component epoxy adhesive that contains a blend of special thermally conductive fillers. This smooth paste system can be applied in bond lines as thin as 10-15 microns. It offers an exceptionally low thermal resistance of 5-7 x 10-6 K•m2/W and a thermal conductivity of 22-25 BTU•in/ft2•hr•°F [3.17-3.61 W/(m·K)]. Heat transfer capabilities of this product are outstanding. Supreme 18TC also passes NASA low outgassing tests and can be used in applications in the aerospace, electronic, optical, specialty OEM and cryogenic industries.... Read More |
| Quantity | 1/2 pints, pints, quarts, gallons | 1/2 pint kits, pint kits, quart kits, gallon kits, gun kits | ½ pint kits, pint kits, quart kits, gallon kits | 20 grams, 50 grams, 100 grams | Ounce, 1/2 pint, pint, quart, gallon |
| Type | One part epoxy | Two part epoxy | Two part epoxy | Addition cured silicone | One part epoxy |
| Format | Inquire | Inquire | Inquire | Inquire | Smooth paste |
| Applications | Bonding, small encapsulation | Bonding, sealing, coating, encapsulation | Bonding, sealing, coating | Bonding, sealing, coating, form-in-place gasketing | Bonding, sealing, coating, encapsulation |
| Applications | Bonding, Encapsulating | Bonding, Coating, Sealing | Bonding, Coating, Sealing | Bonding, Coating, Sealing | Bonding, Coating, Sealing |
| Get Quote | Supplier Page | Supplier Page | Supplier Page | Supplier Page | Supplier Page |