Chemicals are used in laboratories around the globe for a seemingly endless array of experimental and investigative procedures including those in chemistry, biochemistry, cellular biology, and molecular biology. Some categories of chemicals include Acids and Bases, Reagents, Adhesives, Solvents, Buffers, Flammable Liquids and more.
Lab chemicals are vast and can vary in grade, concentration, or consistency in accordance with their intended applications. Chemical grades include ACS Grade (USP and NF are ACS equivalencies), Reagent Grade, Laboratory Grade, and Technical grade.
Explore and compare laboratory chemicals across leading suppliers at Labcompare; including access to product citations and first-hand reviews from our scientific community.
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| Company | Master Bond | Master Bond | Master Bond | Master Bond | Master Bond |
| Item | EP21TCHT-1 Epoxy Compound | EP40TCMed Thermally-conductive Electrically-insulative Epoxy for Medical Devices | EP41S-6 Epoxy System | EP42HT-3AO Thermally-conductive Potting Compound | UV22DC80-1 Dual Cure System |
| Citations | | | | | |
| Catalog Number | EP21TCHT-1 | EP40TCMed | EP41S-6 | EP42HT-3AO | UV22DC80-1 |
| Price | Supplier Page | Supplier Page | Supplier Page | Supplier Page | Supplier Page |
| Description | Master Bond EP21TCHT-1 is a two component, thermally conductive, heat resistant, epoxy compound formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a 100 to 60 mix ratio by weight. EP21TCHT-1 passes NASA outgassing tests. It is a high strength adhesive and Master Bond EP21TCHT-1 is a two component, thermally conductive, heat resistant, epoxy compound formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a 100 to 60 mix ratio by weight. EP21TCHT-1 passes NASA outgassing tests. It is a high strength adhesive and produces bonds that are both tough and durable. It resists thermal cycling and many chemicals including water, fuels and most organic solvents. It has a service temperature range of 4K up to 400°F. It adheres well to metals, glass, ceramics, rubbers and many plastics. The hardened adhesive exhibits high thermal conductivity and superior electrical insulation. The thermal expansion coefficient is remarkably low. EP21TCHT-1 is widely used in aerospace, electronics, electronic, automotive and chemical industries. As a NASA qualified system, it is ideal for high vacuum type applications, particularly those where elevated temperature cures are not possible. It also passes MIL-STD-810G for fungal resistance, and withstands 1,000 hours at 85°C/85% RH.... Read More | EP40TCMed resists many chemicals including water, oils, fuels and most notably, EtO, radiation and several cold sterilants. It passes ISO 10993-5 specifications. | Master Bond EP41S-6 is a two part epoxy system that meets UL 1203 for Explosion-Proof and Dust-Ignition-Proof Electrical Equipment for Use in Hazardous (Classified) Locations. The core of the UL 1203 test protocol is chemical resistance testing. EP41S-6 can be used in potentially explosive Master Bond EP41S-6 is a two part epoxy system that meets UL 1203 for Explosion-Proof and Dust-Ignition-Proof Electrical Equipment for Use in Hazardous (Classified) Locations. The core of the UL 1203 test protocol is chemical resistance testing. EP41S-6 can be used in potentially explosive environments, as defined in National Electrical Code, NFPA 70 (National Fire Protection Association). EP41S-6 is a thermally stable compound possessing a glass transition temperature of 145-150°C and serviceability from -80°F to +500°F [-62°C to +260°C]. It offers a high dielectric strength of 440 volts/mil at 75°F for a 0.125 inch thickness. This compound features good flow properties making it ideal for sealing and potting applications for electrical feedthroughs across various industries.... Read More | EP42HT-3AO is a two component, moderate viscosity epoxy system with good flow properties. It is ideal for small to moderate size encapsulating, potting and casting applications and is NASA low outgassing approved. | Master Bond UV22DC80-1 is a one component, low viscosity, nanosilica filled epoxy based system for bonding, sealing and coating. It is a dual cure systems with UV and heat curing mechanisms. The UV portion of the cure can be achieved in seconds upon exposure to a UV light at 365 nm with 20-40 Master Bond UV22DC80-1 is a one component, low viscosity, nanosilica filled epoxy based system for bonding, sealing and coating. It is a dual cure systems with UV and heat curing mechanisms. The UV portion of the cure can be achieved in seconds upon exposure to a UV light at 365 nm with 20-40 milliwatts/cm2 of energy. This type of formulation allows for polymerization in “shadowed out” areas with the addition of heat at 80°C for 40-60 minutes. This advantageous low temperature is useful when working with plastics or other heat sensitive substrates. The system passes NASA low outgassing specifications. It is electrically insulative, abrasion resistant, has low shrinkage upon cure, and is dimensionally stable. It also features a high physical strength profile. It may be recommended in aerospace, optical and opto-electronic applications.... Read More |
| Quantity | 1/2 pint kits, pint kits, quart kits, gallon kits, premixed and frozen syringes | Ounce jar kits, half pint kits, pint kits, quart kits, premixed and frozen syringes | 1/2 pint kits, pint kits, quart kits, gallon kits | Ounce kits, 1/2 pint kits, pint kits, quart kits | 1/2 pints, pints, quarts, gallons, syringes |
| Type | Two part epoxy | Two part epoxy | Two part epoxy | Two part epoxy | UV curable adhesive |
| Format | Thixotropic paste | Thixotropic | Inquire | Inquire | Inquire |
| Applications | Bonding, sealing | Bonding, sealing | Bonding, sealing, potting | Bonding, sealing, coating, encapsulation | Bonding, sealing, coating |
| Applications | Bonding, Sealing | Bonding, Sealing | Bonding, Sealing | Bonding, Coating, Sealing, Encapsulating | Bonding, Coating, Sealing |
| Get Quote | Supplier Page | Supplier Page | Supplier Page | Supplier Page | Supplier Page |