Chemicals are used in laboratories around the globe for a seemingly endless array of experimental and investigative procedures including those in chemistry, biochemistry, cellular biology, and molecular biology. Some categories of chemicals include Acids and Bases, Reagents, Adhesives, Solvents, Buffers, Flammable Liquids and more.
Lab chemicals are vast and can vary in grade, concentration, or consistency in accordance with their intended applications. Chemical grades include ACS Grade (USP and NF are ACS equivalencies), Reagent Grade, Laboratory Grade, and Technical grade.
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| Company | Master Bond | Master Bond | Master Bond | Master Bond | Master Bond |
| Item | EP29LPSP Epoxy Compound | EP21TDCS-LO Silver Conductive Epoxy Meets NASA Low Outgassing Standards | EP30-4Med Optically Clear Epoxy | Supreme 18TC Conductive Epoxy Adhesive | UV22DC80-1 Dual Cure System |
| Citations | | | | | |
| Catalog Number | EP29LPSP | EP21TDCS-LO | EP30-4Med | Supreme 18TC | UV22DC80-1 |
| Price | Supplier Page | Supplier Page | Supplier Page | Supplier Page | Supplier Page |
| Description | Master Bond EP29LPSP is a two component epoxy adhesive, sealant that can withstand temperatures as low as 4K. It is resistant to cryogenic shocks ,from room temperature down to liquid helium temperatures, in a 5-10 minute time period. The system is NASA low outgassing approved. Additional features Master Bond EP29LPSP is a two component epoxy adhesive, sealant that can withstand temperatures as low as 4K. It is resistant to cryogenic shocks ,from room temperature down to liquid helium temperatures, in a 5-10 minute time period. The system is NASA low outgassing approved. Additional features include optical clarity, electrical insulation and low viscosity. EP29LPSP bonds well to a wide variety of substrates including metals, glass, ceramics, composites and many different plastics. The working life is long, a 100 gram mass will allow over 4-5 hours of working life.... Read More | EP21TDCS-LO is an electrically conductive, silver-filled epoxy widely used for demanding applications in the electronic, electrical, computer, semiconductor, aerospace and optical industries. It is suitable for cryogenic applications, serviceable down to 4K. | EP30-4Med is a two part epoxy system with a fast set up time that cures at room temperature, or even more rapidly with a bit of heat. It resists EtO sterilization, and can also withstand most detergents, disinfectants, bleaches and liquid sterilants. It is recommended for both disposable and EP30-4Med is a two part epoxy system with a fast set up time that cures at room temperature, or even more rapidly with a bit of heat. It resists EtO sterilization, and can also withstand most detergents, disinfectants, bleaches and liquid sterilants. It is recommended for both disposable and reusable instruments.... Read More | Supreme 18TC is a single component epoxy adhesive that contains a blend of special thermally conductive fillers. This smooth paste system can be applied in bond lines as thin as 10-15 microns. It offers an exceptionally low thermal resistance of 5-7 x 10-6 K•m2/W and a thermal conductivity of 22-25 Supreme 18TC is a single component epoxy adhesive that contains a blend of special thermally conductive fillers. This smooth paste system can be applied in bond lines as thin as 10-15 microns. It offers an exceptionally low thermal resistance of 5-7 x 10-6 K•m2/W and a thermal conductivity of 22-25 BTU•in/ft2•hr•°F [3.17-3.61 W/(m·K)]. Heat transfer capabilities of this product are outstanding. Supreme 18TC also passes NASA low outgassing tests and can be used in applications in the aerospace, electronic, optical, specialty OEM and cryogenic industries.... Read More | Master Bond UV22DC80-1 is a one component, low viscosity, nanosilica filled epoxy based system for bonding, sealing and coating. It is a dual cure systems with UV and heat curing mechanisms. The UV portion of the cure can be achieved in seconds upon exposure to a UV light at 365 nm with 20-40 Master Bond UV22DC80-1 is a one component, low viscosity, nanosilica filled epoxy based system for bonding, sealing and coating. It is a dual cure systems with UV and heat curing mechanisms. The UV portion of the cure can be achieved in seconds upon exposure to a UV light at 365 nm with 20-40 milliwatts/cm2 of energy. This type of formulation allows for polymerization in “shadowed out” areas with the addition of heat at 80°C for 40-60 minutes. This advantageous low temperature is useful when working with plastics or other heat sensitive substrates. The system passes NASA low outgassing specifications. It is electrically insulative, abrasion resistant, has low shrinkage upon cure, and is dimensionally stable. It also features a high physical strength profile. It may be recommended in aerospace, optical and opto-electronic applications.... Read More |
| Quantity | 1/2 pint kits, pint kits, quart kits, gallon kits, premixed and frozen syringes | 20 gram kits, 50 gram kits, 100 gram kits, 1 pound kits, premixed and frozen syringes | ½ pint kits, pint kits, quart kits, gallon kits, gun dispensers | Ounce, 1/2 pint, pint, quart, gallon | 1/2 pints, pints, quarts, gallons, syringes |
| Type | Two part epoxy | Two part epoxy | Two part epoxy | One part epoxy | UV curable adhesive |
| Format | Inquire | Paste | Inquire | Smooth paste | Inquire |
| Applications | Bonding, sealing, potting, casting | Bonding, sealing | Bonding, sealing, coating, casting | Bonding, sealing, coating, encapsulation | Bonding, sealing, coating |
| Applications | Bonding, Sealing | Bonding, Sealing | Bonding, Coating, Sealing | Bonding, Coating, Sealing | Bonding, Coating, Sealing |
| Get Quote | Supplier Page | Supplier Page | Supplier Page | Supplier Page | Supplier Page |