Description
Master Bond EP30-2 is a lower viscosity, two component epoxy for high performance bonding, sealing, coating and small potting applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures with a 10 to 1 mix ratio by weight. This system is recommended where low viscosity is required, and for applications in which bonded assemblies must exhibit superior dimensional stability. Shrinkage upon cure is exceptionally low. It forms high strength and tough bonds which are resistant to thermal cycling and chemicals including water, oil and most organic solvents. It is serviceable over the temperature range of 4K to 300°F. Adhesion to both similar and dissimilar materials including metals, glass, ceramics, rubbers and many plastics is excellent. It is electrically insulative and optically clear. Master Bond EP30-2 is widely used in the aerospace, electronic, optical, and specialty OEM industries. EP30-2 also meets NASA Low Outgassing specifications.