EP3UF No Mix, Thermally-conductive, Electrically-insulative Epoxy for Underfill Applications from Master Bond

Supplier Page

Supplier Page from
Master Bond for
EP3UF No Mix, Thermally-conductive, Electrically-insulative Epoxy for Underfill Applications

Description

EP3UF is a one component epoxy that contains thermally conductive fillers with very small particle sizes imparting a low thermal resistance. This low viscosity system has good flow properties and can be applied in bond lines as thin as 10-15 microns.