Credit: Ralfy Kenaz et al.
Researchers at The Hebrew University of Jerusalem have developed and patented a new system and methodology for rapid thin-film thickness measurements. Traditional techniques and instrumentation are only able to accurately measure areas greater than 50 microns, while the newly developed methods allow for rapid and precise measurement in areas as small as 2 microns.
In a study published in ACS Nano, A team of researchers developed a new method of analyzing 2D flakes utilizing a Spectroscopic Micro-Ellipsometer (SME). The new technique boasts not only better resolution but data acquisition that is three orders of magnitude faster than traditional techniques. Unlike traditional methods, the newly patented method presented in the study provides optical data at multiple angles simultaneously, providing users with greater sensitivity as well as providing a method to map inhomogeneity in samples.
The implications of this research are far-reaching, with potential applications in various industries and research fields including nanotechnology and nanoscience. The new methodologies developed will lead to advancements in technology as well as advanced characterization and understanding of nanoscale metamaterials. The instrumentation used by the researchers can easily be integrated as an add-on unit into existing analytical systems involving spectroscopic imagery, creating a cost-effective way for laboratories to scale to include this analysis technique.