Thermal shock testing reveals an element or sample's behavior while undergoing rapid changes in temperature. Thermal shock chambers are often used for testing the resilience of microelectronic devices in the face of sudden temperature shifts. These thermal stress-testing chambers typically have two compartments for hot and cold, though some models offer and intermediate third chamber for ambient/room temperature. A thermal shock chamber will typically have a temperature between -100C and 200C. Thermal shock chambers can affect temperature changes of up to +/- 70C per minute. These high-throughput thermal shock testers often share attributes of other environmental test chambers, including humidity and vibration functionality.