Discovery Xenon Flash 200+ Thermal Conductivity Instrument from TA Instruments

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Discovery Xenon Flash 200+ Thermal Conductivity Instrument

Description

The Discovery Xenon Flash 200+ features a patented High Speed Xenon-Pulse Delivery™ source (HSXD) and a multi-faceted Light Pipe™. Together these optics deliver a light pulse of unsurpassed power and uniform intensity to the specimen while preventing sample holder overflash. Only TA Instruments high energy Xenon design is capable of testing samples to a diameter of 25.4 mm over a temperature range from -175 °C to 900 °C. The use of large samples diminishes errors associated with inhomogeneity and permits representative measurements of poorly dispersed composites. The DXF platform is designed for research and development programs as well as production control.

DXF 200+ Features
  • Sub-ambient temperature system with highly efficient liquid nitrogen cooling system and solid state PIN detectors for accurate and stable temperature control to an industry leading -175°C.
  • Easily swappable autosampler trays can accommodate up to twelve samples 12.7 mm diameter or six 25.4 mm diameter samples, plus many more sizes and shapes.
  • Software controlled PIN loading can be adjusted to maintain perfect contact regardless of sample thickness.
  • Patented High Speed Xenon-Pulse-Delivery system provides 50% more energy than competitive designs for the highest degree of accuracy on widest range of samples regardless of thickness or thermal conductivity.
  • Wide variety of sample trays accommodates multiple sample sizes (up to 25.4 mm), shapes, and special fixtures (liquids, powders, laminates, films, etc.) for maximum sample testing flexibility.
  • Patented Light Pipe™ for the most effective collection and collimation of light and homogeneous delivery of radiation to the sample.
  • Can test samples with maximum diameter of 25.4 mm diameter for easier sample preparation and handling, as well as improved results for inhomogeneous materials.
  • Real-time pulse mapping for superior thermal diffusivity of thin and highly conductive materials.
  • Designed to meet industry standard test methods including: ASTM E1461, ASTM C714, ASTM E2585, ISO 13826, ISO 22007-Part4, ISO 18755, BS ENV 1159-2, DIN 30905, and DIN EN821