TESCAN Group has unveiled two software innovations at this year’s Microscopy & Microanalysis (M&M) conference in Salt Lake City. These launches reflect TESCAN’s ongoing shift toward a more integrated approach, combining advanced technology, workflow-driven solutions, expert support, and a community built on shared insight.
This year the company is focusing on automation across its entire product range. The aim is to simplify scientists’ workflows by increasing repeatability and reducing the need for constant operator input.
AutoSection
AutoSection is an automation module built into TESCAN’s Essence software platform for FIB-SEM systems, enabling users to easily define a region for cross-sectioning. The system then mills fully automatically, using AI-driven end-pointing to stop precisely at the target feature — no over- or under-polishing. It is ideal for fault isolation and package inspection and fully integrated into laser and FIB-SEM workflows. AutoSection is most effective when paired with the Mistral plasma FIB and the Rocking Stage.
TEM AutoPrep PRO – Inverted & Planar Lamella Automation
The latest generation of TESCAN’s module for fully automated TEM sample preparation now supports both planar and inverted lamella orientations. Thanks to the patented OptiLift manipulator, the entire process is completed without manual intervention, re-welding, or the need for special stages. This enables speed and flexibility in preparing complex semiconductor and materials science samples.